tpd2e001-q1 www.ti.com slls993 ? november 2009 low-capacitance 2-channel 15-kv esd-protection array for high-speed data interfaces check for samples: tpd2e001-q1 1 features applications ? usb 2.0 2 ? qualified for automotive applications ? ethernet ? esd protection exceeds ? firewire ? ? 15-kv human-body model (hbm) ? video ? 8-kv iec 61000-4-2 contact discharge ? cell phones ? 15-kv iec 61000-4-2 air-gap discharge ? svga video connections ? low 1.5-pf input capacitance ? glucose meters ? low 1-na (max) leakage current ? 0.9-v to 5.5-v supply-voltage range ? two-channel device ? space-saving drl package ? alternate 3-, 4-, 6-channel options available: tpd3e001, tpd4e001, and tpd6e001 description/ordering information the tpd2e001 is a low-capacitance 15-kv esd-protection diode array designed to protect sensitive electronics attached to communication lines. each channel consists of a pair of diodes that steer esd current pulses to v cc or gnd. the tpd2e001 protects against esd pulses up to 15-kv human-body model (hbm), 8-kv contact discharge, and 15-kv air-gap discharge, as specified in iec 61000-4-2. this device has a 1.5-pf capacitance per channel, making it ideal for use in high-speed data io interfaces. the tpd2e001 is a two-channel device intended for usb and usb 2.0 applications. the tpd2e001 is available in the drl package and is specified for ? 40 c to 85 c operation. ordering information (1) t a package (2) orderable part number top-side marking ? 40 c to 85 c sot-533 ? drl reel of 4000 TPD2E001IDRLRQ1 oeq (1) for the most current package and ordering information, see the package option addendum at the end of this document, or see the ti web site at www.ti.com . (2) package drawings, thermal data, and symbolization are available at www.ti.com/packaging . 1 please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2 firewire is a trademark of apple computer, inc. production data information is current as of publication date. copyright ? 2009, texas instruments incorporated products conform to specifications per the terms of the texas instruments standard warranty. production processing does not necessarily include testing of all parameters. nc C no internal connection gnd v cc nc drl package (top view) io1 io2 23 4 5 1
tpd2e001-q1 slls993 ? november 2009 www.ti.com logic block diagram pin description no. name function 3, 5 iox esd-protected channel 4 gnd ground 1 v cc power-supply input. bypass v cc to gnd with a 0.1- f ceramic capacitor. 2 n.c. no connection. not internally connected. ep exposed pad. connect to gnd. 2 submit documentation feedback copyright ? 2009, texas instruments incorporated product folder link(s): tpd2e001-q1 io2 gnd io1 v cc
tpd2e001-q1 www.ti.com slls993 ? november 2009 absolute maximum ratings (1) over operating free-air temperature range (unless otherwise noted) min max unit v cc ? 0.3 7 v v io ? 0.3 v cc + 0.3 v t stg storage temperature range ? 65 150 c t j junction temperature 150 c infrared (15 s) 220 bump temperature (soldering) c vapor phase (60 s) 215 lead temperature (soldering, 10 s) 300 c (1) stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. exposure to absolute-maximum-rating conditions for extended periods may affect device reliability. electrical characteristics v cc = 5 v 10%, t a = -40 c to 85 c (unless otherwise noted) parameter test conditions min typ (1) max unit v cc supply voltage 0.9 5.5 v i cc supply current 1 120 na v f diode forward voltage i f = 10 ma 0.65 0.95 v v br breakdown voltage i br = 10ma 11 v positive transients v cc + 25 t a = 25 c, 15-kv hbm, i f = 10 a negative transients ? 25 t a = 25 c, positive transients v cc + 60 8-kv contact discharge v c channel clamp voltage (2) v negative transients ? 60 (iec 61000-4-2), i f = 24 a t a = 25 c, positive transients v cc + 100 15-kv air-gap discharge negative transients ? 100 (iec 61000-4-2), i f = 45 a i i/o channel leakage current (2) v i/o = gnd to v cc 1 na c i/o channel input capacitance v cc = 5 v, bias of v cc /2 1.5 pf (1) typical values are at v cc = 5 v and t a = 25 c (2) not production tested esd protection parameter typ unit hbm 15 kv iec 61000-4-2 contact discharge 8 kv iec 61000-4-2 air-gap discharge 15 kv copyright ? 2009, texas instruments incorporated submit documentation feedback 3 product folder link(s): tpd2e001-q1
tpd2e001-q1 slls993 ? november 2009 www.ti.com typical operating characteristics io capacitance vs io voltage (v cc = 5.0 v) io leakage current vs temperature (v cc = 5.5 v) 4 submit documentation feedback copyright ? 2009, texas instruments incorporated product folder link(s): tpd2e001-q1 1 10 100 1000 ?40 25 45 65 85 temperature (c) io leakage current (pa) 0.00 1.00 2.00 2.50 3.00 4.00 5.00 io voltage (v) 1.00 1.20 1.40 1.60 1.80 2.00 2.20 io capacitance (pf)
tpd2e001-q1 www.ti.com slls993 ? november 2009 application information detailed description when placed near the connector, the tpd2e001 esd solution offers little or no signal distortion during normal operation due to low io capacitance and ultra-low leakage current specifications. the tpd2e001 ensures that the core circuitry is protected and the system is functioning properly in the event of an esd strike. for proper operation, the following layout/ design guidelines should be followed: 1. place the tpd2e001 solution close to the connector. this allows the tpd2e001 to take away the energy associated with esd strike before it reaches the internal circuitry of the system board. 2. place a 0.1- f capacitor very close to the v cc pin. this limits any momentary voltage surge at the io pin during the esd strike event. 3. make sure that there is enough metallization for the v cc and gnd loop. during normal operation, the tpd2e001 consumes na leakage current. but during the esd event, v cc and gnd may see 15 a to 30 a of current, depending on the esd level. sufficient current path enables safe discharge of all the energy associated with the esd strike. 4. leave the unused io pins floating. 5. the v cc pin can be connected in two different ways: ( a) if the v cc pin is connected to the system power supply, the tpd2e001 works as a transient suppressor for any signal swing above v cc + v f . a 0.1- f capacitor on the device v cc pin is recommended for esd bypass. ( b) if the v cc pin is not connected to the system power supply, the tpd2e001 can tolerate higher signal swing in the range up to 10 v. please note that a 0.1- f capacitor is still recommended at the v cc pin for esd bypass. copyright ? 2009, texas instruments incorporated submit documentation feedback 5 product folder link(s): tpd2e001-q1 0.1 f usb controller r t r t v bus d+d? gnd gnd io2 d1 io1 v cc
packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) TPD2E001IDRLRQ1 active sot drl 5 4000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. other qualified versions of tpd2e001-q1 : ? catalog: tpd2e001 note: qualified version definitions: ? catalog - ti's standard catalog product package option addendum www.ti.com 5-oct-2009 addendum-page 1
tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant TPD2E001IDRLRQ1 sot drl 5 4000 180.0 8.4 1.78 1.78 0.69 4.0 8.0 q3 package materials information www.ti.com 6-may-2011 pack materials-page 1
*all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) TPD2E001IDRLRQ1 sot drl 5 4000 202.0 201.0 28.0 package materials information www.ti.com 6-may-2011 pack materials-page 2
important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all products are sold subject to ti ? s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with ti ? s standard warranty. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. ti assumes no liability for applications assistance or customer product design. customers are responsible for their products and applications using ti components. to minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. ti does not warrant or represent that any license, either express or implied, is granted under any ti patent right, copyright, mask work right, or other ti intellectual property right relating to any combination, machine, or process in which ti products or services are used. information published by ti regarding third-party products or services does not constitute a license from ti to use such products or services or a warranty or endorsement thereof. use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from ti under the patents or other intellectual property of ti. reproduction of ti information in ti data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. reproduction of this information with alteration is an unfair and deceptive business practice. ti is not responsible or liable for such altered documentation. information of third parties may be subject to additional restrictions. resale of ti products or services with statements different from or beyond the parameters stated by ti for that product or service voids all express and any implied warranties for the associated ti product or service and is an unfair and deceptive business practice. ti is not responsible or liable for any such statements. ti products are not authorized for use in safety-critical applications (such as life support) where a failure of the ti product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of ti products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by ti. further, buyers must fully indemnify ti and its representatives against any damages arising out of the use of ti products in such safety-critical applications. ti products are neither designed nor intended for use in military/aerospace applications or environments unless the ti products are specifically designated by ti as military-grade or " enhanced plastic. " only products designated by ti as military-grade meet military specifications. buyers acknowledge and agree that any such use of ti products which ti has not designated as military-grade is solely at the buyer ' s risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. ti products are neither designed nor intended for use in automotive applications or environments unless the specific ti products are designated by ti as compliant with iso/ts 16949 requirements. buyers acknowledge and agree that, if they use any non-designated products in automotive applications, ti will not be responsible for any failure to meet such requirements. following are urls where you can obtain information on other texas instruments products and application solutions: products applications audio www.ti.com/audio communications and telecom www.ti.com/communications amplifiers amplifier.ti.com computers and peripherals www.ti.com/computers data converters dataconverter.ti.com consumer electronics www.ti.com/consumer-apps dlp ? products www.dlp.com energy and lighting www.ti.com/energy dsp dsp.ti.com industrial www.ti.com/industrial clocks and timers www.ti.com/clocks medical www.ti.com/medical interface interface.ti.com security www.ti.com/security logic logic.ti.com space, avionics and defense www.ti.com/space-avionics-defense power mgmt power.ti.com transportation and www.ti.com/automotive automotive microcontrollers microcontroller.ti.com video and imaging www.ti.com/video rfid www.ti-rfid.com wireless www.ti.com/wireless-apps rf/if and zigbee ? solutions www.ti.com/lprf ti e2e community home page e2e.ti.com mailing address: texas instruments, post office box 655303, dallas, texas 75265 copyright ? 2011, texas instruments incorporated
|
